Vertical Batch Furnace
Newest release Advanced/Rapid Vertical Processor for 150mm and 200mm wafers
The AVP Ace vertical batch furnace delivers superior process results, the lowest cost of ownership (CoO) and leading flexibility for diffusion, oxidation, and LPCVD applications.
The AVP Ace improves upon previous version process modules and integrates with updated control architecture. Customized to meet your specific engineering requirements.
Feature
AVP Ace provides stable thermal processing with precise temperature control from 100°C to 1250°C. Advanced gas injection and low-oxygen load lock ensure consistent, repeatable results.
– Excellent temperature control from 100-1250℃
– Advanced injector technology for optimal gas distribution
– Low O₂ load lock maintains controlled wafer environment and ensures repeatability
– Uses qualified process module
– Single or dual-boat configuration
– Modular architecture for fast move in and startup
– Dual-boat configuration eliminates wafer load/unload time
– In-situ clean capability reduces CoO by up to 50%
– Fast temperature ramp/cool option enables up to 30% reduction in process time
– Runs 2 wafer sizes simultaneously with no hardware changes
– Compatible with perforated, bonded and ultra-thin substrates
– Field conversion kits enable fast applications changes
Capability
Designed for thermal oxidation, silicon nitride, and ALD, AVP Ace delivers stable, repeatable processing for advanced semiconductor applications.
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