AVP/RVP
These previous versions of the AVP Ace are vertical batch furnaces with a flexible platform for diffusion, oxidation, and LPCVD processes.
Vertical Batch Furnace
AVP/RVP
AVP-8000, AVP-8200, RVP-9000, and RVP-9200 Vertical Processors for 150-200mm wafers
Feature
Versatile Platform for Proven Batch Processing
Supports diffusion, oxidation, and LPCVD with a single flexible toolset.
A trusted choice for 150–200mm wafer manufacturing across generations.
Key Advantages for Legacy Thermal Processing
- Advanced/Rapid Vertical Process
- Small footprint enables side by side installation
- Low Cost of Ownership
- Single or Dual boat configuration
- Up to 200 wafer batch
- Remanufactured tools available (subject to donor availability)
- Flexible substrate handling
- 150mm and or 200mm wafers
- Perforated and thin/bowed wafers
Capability
High-Performance Capabilities for Oxidation, LPCVD, ALD and Annealing
Delivers high-quality films for key processes like wet/dry oxidation, SiN, and ALD.
Supports 100–1200°C thermal steps for both legacy and advanced applications.
- Wet/dry thermal oxide
- Radical oxidation
- Silicon Nitride (Stoichiometric and low stress)
- TEOS, SiH₄ and DCS-based SiO₂
- Doped (P, As, B) and un-doped polysilicon
- Atomic Layer Deposition
- Anneal and Cure : 100 to >1200°C
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