Micro Electro Mechanical Systems (MEMS) are essential components in today’s smart technologies—ranging from smartphones and automotive sensors to medical diagnostics, industrial automation, and RF systems.

As MEMS devices become smaller, more complex, and more functionally integrated, manufacturers face growing demands for high-precision processes and ultra-clean surfaces across various layers and materials.

SPT supports MEMS innovation with advanced etching, deposition, and thermal processing systems tailored for fine-featured structures and mass production requirements.

MEMS manufacturing involves complex multi-layer structures, often with deep cavities, thin films, and sacrificial layers. Major technical challenges include:

• Deep silicon etching with high aspect ratios:

  MEMS structures often require etching depths over 100 μm while maintaining vertical sidewalls and precise profiles.

• Thin film stress control:

  Films deposited by PECVD or LPCVD must offer low residual stress, excellent step coverage, and uniformity to ensure device reliability.

• Multi-layer alignment and integration:

  As MEMS designs become more functional, precise control over deposition and etch-back of structural and sacrificial layers is essential.

• Surface quality and consistency:

  Smooth etched surfaces, minimized tilting or notching, and reproducible results across wafer lots are critical for yield.