SEMICON China 2026 期間特別セミナー

SEMICON China 2026 会場では語りきれない技術を。
100名限定・期間限定特別セッション。

SEMICON China 2026 には、中国国内外から多くの技術者・研究者・管理職が集まります。
展示会場では数多くの最新技術や製品が紹介されますが、限られた時間の中で、技術の背景や思想、実践知見までを深く議論する機会は必ずしも多くありません。
もし、展示会の喧騒から少し離れ、より集中した環境で技術と向き合う時間を確保したいとお考えであれば――
本企画は、そのための場です。
SEMICON China 2026 期間中、日本で30年以上にわたり半導体プロセス技術を磨いてきたSPTが、会場近隣にて少人数制の技術セミナーを開催いたします。

特別講演

氏名：于 大全 (Daquan Yu)
役職：Chairman
所属：Sky Semi

講演タイトル：
「Si TSV」

概要：
As three-dimensional integration technologies continue to develop towards higher densities, reliable metallization of ultra-high aspect ratio (>20:1) vias has become a critical challenge, with the core difficulty lying in the deposition of continuous and uniform thin films. Atomic layer deposition (ALD), with its inherent self-limiting surface reactions and exceptional conformality, has emerged as the only viable solution to address this challenge. This paper systematically reviews the recent advances in ALD technologies for insulating layers, barrier layers, and copper seed layers.

講演者紹介：
(Senior Member, IEEE) received the B.E. and Ph.D. degrees in materials science and engineering from the Dalian University of Technology, Dalian, China, in 1999 and 2004, respectively. From 2005 to 2007, he was a Humboldt Research Fellow with the Institute for Integration and Reliability, Fraunhofer IZM, Berlin, Germany. From 2007 to 2010, he was a Senior Research Engineer with the Institute of Microelectronics, Singapore. From 2010 to 2015, he was a Professor with the Institute of Microelectronics, Chinese Academy of Sciences, Beijing, China. From 2014 to 2019, he was the President of the Research Academy of Advanced Packaging Technology, Huatian Group, China. Since 2019, he has been a Distinguished Professor with the School of Electronic Science and Engineering, Xiamen University, Xiamen, China. He is also the founder of Xiamen Sky Semiconductor Company Ltd. He has authored over 260 journal articles and conference papers. His current research interests include, 3-D integration, through glass vias, integrated passive devices, Co-Packaged Optics and diamond heat dissipation.

SPT技術講演

氏名：林　俊甫
所属：SPPテクノロジーズ(株)
役職：Process Engineer

講演タイトル：
「New AI-Driven Applications and Processes in MEMS and Compound Semiconductors」

概要：
The rapid evolution of AI technologies is reshaping both device architecture and manufacturing requirements in MEMS and compound semiconductor applications.This session introduces emerging AI-driven applications and explores how process integration, precision etching, and advanced deposition technologies must evolve to support increasing performance, complexity, and reliability demands.Drawing on practical process experience, we will discuss key technical considerations and future directions for enabling next-generation MEMS and compound semiconductor devices.

講演者紹介：
Morgan Lin received his master’s degree in Chemical and Material Engineering from National Central University in Taiwan, focusing on electrochemistry and nanomaterials, and later pursued doctoral research at Tokyo Institute of Technology on thin film deposition. He has over five years of experience in the semiconductor industry, specializing in dry etching and process optimization. Previously, he worked at a leading semiconductor foundry, where he was engaged in SPC system support, FMEA and SPEC management, cost reduction, and next-generation process development. He is currently a Process Engineer at SPT, working on both dry etching and thin-film deposition technologies to provide advanced process solutions for MEMS and semiconductor applications.

SEMICON China 2026 の期間中、技術に集中できる時間を設けたい皆様とお会いできることを楽しみにしております。
本セミナーは100名限定にて実施予定です。参加をご希望の方は、営業よりお問い合わせのフォームよりお申込みください。
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