SPP Teclorogy

Etching

RIE

Engineered for hard-to-etch materials like compound semiconductors and thermal oxide films.

Spica, Sirius, Sculptor

SPT’s Reactive Ion Etching (RIE) systems — Spica, Sirius, and Sculptor — are designed for precise, high-uniformity etching of hard-to-process materials such as SiC, GaN, compound semiconductors, and thermal oxide. With advanced plasma control and optimized chamber design, our tools deliver excellent anisotropy, selectivity, and process stability for both R&D and mass production environments.

Applications:

  • Through-Silicon Via (TSV)
  • Power Devices
  • LED Devices
  • Optical Devices
  • RF Devices (Radio Frequency Devices)

Features

Why Choose SPT for High-Precision RIE

Optimized Plasma for Difficult Materials

Delivers stable etching for compound semiconductors and oxide films.

Industry-Leading SiC Etch Rate

Ideal for RF and power device manufacturing.

High-Speed Etching for Optical Devices

Processes hard materials like SiO₂ and LiNbO₃ with speed and precision.

Precise Etching of Organic Films

Enables vertical anisotropic etching of polymer layers.

Enables vertical anisotropic etching of polymer layers.

Available in load-lock and cluster tool formats.

Performance

RIE Performance for Material Selectivity, Profile Control, and Precision Etching

SPT’s RIE platforms—Spica, Sirius, and Sculptor—deliver outstanding etch performance for a wide variety of materials and applications. From vertical etching of organic films to precise taper profiles in SiC and uniform oxide etching for optical waveguides, our systems enable superior selectivity, profile control, and surface quality essential for next-generation devices.

Vertical Etching of Organic Films

High-Speed Etching of LiNbO₃

Tapered SiC Etching

(Courtesy of RFMD)

Multilayer SiO₂ Etching for Optical Waveguides

Specifications

Flexible RIE System Architecture: Tailor Your Platform to Process Demands

SPT’s RIE systems provide flexible configuration options to meet a wide range of application requirements. Choose from multiple process modules and system platforms—ideal for everything from organic film etching in MEMS R&D to high-throughput SiC or oxide etching in mass production.

Process Module

  • Spica

  • Sirius

  • Sculptor

  • Wafer size (mm)

  • 200

  • 200

  • 200

  • Platform

  • APX, DPX, VPX, CPX

  • APX, DPX, VPX, CPX

  • APX, DPX, VPX, CPX

  • Etching Speed

  • Medium

  • High

  • High

  • Processing Damage

  • Extremely Low

  • Low

  • Low

  • Substrates

  • GaN, GaAs

  • SiO2, SiN, quartz, Glass

  • SiC

Platform

  • APX

  • DPX

  • VPX

  • CPX

  • Intended Use

  • R&D

  • Prototype

  • Small Volume

  • Mass Production

  • Number of Chambers

  • 1

  • 2

  • 3

  • 4

  • Cassette Transfer Robot

  • Atmospheric

  • Vacuum

  • Vacuum

  • Robot Motion

  • 2-Axis

  • 2-Axis

  • 3-Axis

  • 3-Axis

  • Number of Cassette Stations

  • 0

  • 2

  • 1

  • 2

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      **We do not accept any sales proposals via our website.